Earbud
R2026bLibraries:
Simscape Acoustics /
Applications /
Headphones
Description
Add-On Required: This feature requires the Simscape Acoustics add-on.
This block models an earbud-type headphone enclosure. The front of the earbud includes a front chamber with holes, followed by a front cover. The block includes a sound tube to model the pinna and ear tip cushion to model in-ear earbuds. The back of the earbud consists of a rear chamber, rear vent holes, an earphone cavity chamber, and holes in the rear of the cavity.
You can use this block to model variations of an earbud enclosure. The front cover, front cavity, rear chamber, and pinna modeling are optional. You can also model leakage caused by an imperfect fit between the earbud and ear. This block does not model the loudspeaker inside the enclosure, but you can connect the F+ and R+ ports to a Microspeaker block or a custom microspeaker model.
The Earbud block models the physical properties of an earbud by implementing an equivalent circuit, depicted in figure 4 of the reference [1], using Simscape™ blocks. The reference provides the default values [1], which were validated against measurements from an IEC-60711 coupler [2]. The figure shows the equivalent circuit that uses the following Simscape blocks:
The Earbud block models the compliance of air in the front chamber, pinna outer chamber cavity, rear chamber, and earphone cavity using one Acoustic Compliance block per chamber or cavity.
The Earbud block models the radiation impedance of each opening (front cover holes, rear vent holes, rear cavity holes, and leakage from imperfect fit) using one pair of Acoustic Inertance and Acoustic Resistance blocks per opening.
The Earbud block models the transmission lines of the pinna circular cavity and the ear tip using Cylindrical Tube With Thermoviscous Losses Using Foster Network blocks.
The Earbud block connects both the front and rear of the enclosure to an Acoustic Reference block.

Examples
Ports
Conserving
Parameters
References
[1] Huang, Chen-Hung, S. J. Pawar, Zih-Jyun Hong, and Jin H. Huang. “Earbud-Type Earphone Modeling and Measurement by Head and Torso Simulator.” Applied Acoustics 73, no. 5 (2012): 461–69. https://doi.org/10.1016/j.apacoust.2011.10.007.
[2] Huang, Chen-Hung, S. J. Pawar, Zih-Jyun Hong, and Jin H. Huang. “Insert Earphone Modeling and Measurement by IEC-60711 Coupler.” IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 58, no. 2 (2011): 461–69. https://doi.org/10.1109/TUFFC.2011.1823.
Version History
Introduced in R2026b

