主要内容

Thermal

基础热组件

使用考尔表示法和福斯特表示法对热功率损耗进行建模。

Simscape 模块

Cauer Thermal ModelHeat transfer through multiple layers of a semiconductor module
Foster Thermal ModelHeat transfer through a semiconductor module
HeatsinkDissipate heat from power semiconductors to ambient temperature (自 R2021b 起)
Thermal ResistorHeat transfer by conduction through a layer of material

主题